ZTE MW3736Hardware Design User Manual Intend to OEM Integrator Installation Version：V1.
Intend to OEM Integrator Installation Copyright Statement If you accept this manual of ZTE Corporation, it means that you have agreed to the following terms and conditions; if you don’t agree, please stop using this manual. The copyright of this manual belongs to ZTE Corporation. ZTE Corporation reserves any rights not expressly granted in this manual. The contents in this manual are the proprietary information of ZTE Corporation.
Intend to OEM Integrator Installation Version update description Product version Document version V1.0 Document No. Document update descriptions Released for the first time Writer Document version Date V1.0 2012‐08‐07 第 II 页 Written by Liu Changdi Yu Xianwu © ZTE Corporation. All rights reserved.
Intend to OEM Integrator Installation Important compliance information for North American users The MW3736 Module has been granted modular approval for mobile applications. Integrators may use the MW3736 Module in their final products without additional FCC certification if they meet the following conditions. Otherwise, additional FCC approvals must be obtained. 1. At least 20cm separation distance between the antenna and the user’s body must be maintained at all times. 2.
Intend to OEM Integrator Installation With strong technical force, ZTE Corporation can provide CDMA/GPRS/WCDMA/GSM module customers with the following all‐around technical support: 1. Provide complete technical documentation; 2. Provide the development board used for R&D, test, production, after‐sales, etc. 3. Provide evaluations and technical diagnosis for principle diagram, PCB, test scenarios; 4.
Intend to OEM Integrator Installation Preface Summary This user manual mainly describes ZTE MW3736 module’s product principle diagram, module’s PINs, hardware interfaces and module structure. This manual is used to instruct the users on the module’s hardware design, and on the basis of this module, quickly and conveniently design different kinds of wireless terminals.
Intend to OEM Integrator Installation Contents 1 2 3 4 5 MODULE’S GENERAL DESCRIPTION .......................................................................... 1 1.1 INTRODUCTION TO MODULE’S FUNCTIONS ..................................................... 1 1.2 MODULE’S PRINCIPLE BLOCK DIAGRAM .......................................................... 2 1.3 ABBREVIATIONS ...................................................................................................
Intend to OEM Integrator Installation 1 Module’s General Description With 36‐PIN stamp‐hole interface, MW3736 module developed by ZTE Corporation is a kind of WCDMA/GSM industrial module, which can be built in the Set‐Top‐Box, vehicle‐mounted terminals, and enable users to get access to the Internet wirelessly and send/receive Emails, browse the web pages, download at high speed and play online videos, etc.
Intend to OEM Integrator Installation Parameters MW3736 Connection method 36 Pin stamp‐hole Antenna U.FL‐R‐SMT 50ohm antenna connector Integrated full duplex port AT command, data transmission UIM card socket level 1.8V /2.85V Data service Mode WCDMA/ GSM/EDGE Max. downlink data rate 14.4Mbps Max. uplink data rate 5.
Intend to OEM Integrator Installation MW3736_ principle diagram: 1.3 Abbreviations Table 1‐2 Introduction to Abbreviations A ADC Analog‐Digital Converter AFC Automatic Frequency Control AGC Automatic Gain Control ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point ASIC Application Specific Integrated Circuit B BER Bit Error Rate BTS Base Transceiver Station It’s not allowed to spread without the permission of ZTE Corporation. © ZTE Corporation. All rights reserved.
Intend to OEM Integrator Installation C CDMA Code Division Multiple Access CDG CDMA Development Group CS Coding Scheme CSD Circuit Switched Data CPU Central Processing Unit D DAI Digital Audio interface DAC Digital‐to‐Analog Converter DCE Data Communication Equipment DSP Digital Signal Processor DTE Data Terminal Equipment DTMF Dual Tone Multi‐Frequency DTR Data Terminal Ready E EFR Enhanced Full Rate EGSM Enhanced GSM EMC Electromagnetic Compatibility EMI Electro Magnetic In
Intend to OEM Integrator Installation PCL Power Control Level PCS Personal Communication System PDU Protocol Data Unit PLL Phase Locked Loop PPP Point‐to‐point protocol R RAM Random Access Memory RF Radio Frequency ROM Read‐only Memory RMS Root Mean Square RTC Real Time Clock S SIM Subscriber Identification Module SMS Short Message Service SRAM Static Random Access Memory T TA Terminal adapter TDMA Time Division Multiple Access TE Terminal Equipment also referred it as DTE U
Intend to OEM Integrator Installation 2 Description of Module’s External Interf aces MW3736 module adopts 36pin stamp‐hole interface to connect externally. 2.
Intend to OEM Integrator Installation channel1 ‐ Reset 13 Power Reset signal 1.8V, valid upon low level VBUS I USB power +5V 16 VBAT I Module’s main power 3.3V‐4.2V 17 V_MSME_1V8 O Digital power Voltage output, 1.8V 18 VBAT I Module’s main power 3.3V‐4.2V Power on/off control 1.8V, valid upon low 21 ON/OFF /CTS I I level Clear to send 1.8V, valid upon low level 22 RXD I Receive data 1.8V 23 TXD O Transmit data 1.8V 24 RI O Ringtone 1.8V Request to send 1.
Intend to OEM Integrator Installation 35 36 Note: （1） The default function is WAKEUP, and generally it is at high level. After entering the USB sleep mode, the module needs to wake up the main controller (or PC) to trigger certain event (e.g., call or text message); in this case, it displays the level variation of “Low—High‐‐Low”, and each state lasts for 1 second; after that, the PIN automatically becomes high level, and the main controller (or PC) needs to send USB wakeup command to awaken the module.
Intend to OEM Integrator Installation or RF port Program 2: When using RF plug as the antenna feed, disconnect PIN2 from the main board and make sure there are some clean areas below or around PIN2. Keep 2mm distance between the surface of PIN2 and GND, and drill holes below PIN2. It’s not suggested to use the compatible design of PIN2 at the same time when using the RF connector.
Intend to OEM Integrator Installation GPRS1900 EDGE850 EDGE1900 3 1850MHz‐1910MHz 824MHz‐849MHz 1850MHz‐1910MHz 1930MHz‐1990MHz 869MHz‐894MHz 1930MHz‐1990MHz 28.5±0.5 32 +‐0.5 30+‐0.5 < ‐108dBm < ‐108dBm < ‐108dBm Module’s Electrical Characteristics This chapter mainly introduces the module’s electrical characteristics, including module’s interface level, power consumption, reliability, etc. 3.
Intend to OEM Integrator Installation Table 3‐1 Power on/off circuit time characteristics 3.3 Reliability Before leaving the factory, the module has gone through a series of reliability tests, such as: high/low temperature operation, high/low temperature storage, thermal shock, alternating temperature humidity, etc. The test results conform to the requirements in the industry.
Intend to OEM Integrator Installation Table 3‐4 Module’s ESD characteristics Interface Antenna interface UIM card interface © 第 12 页 Test items Test requirements Performance Air discharging ±8 kV Nothing wrong Contact discharging ±６ kV Nothing wrong Air discharging ±8 kV Nothing wrong Contact discharging ±６ kV Nothing wrong ZTE Corporation. reserved.
Intend to OEM Integrator Installation 4 Reference Design of Interf ace Circuits This chapter describes the reference design of interface circuits and precautions according to the module’s functions. 4.1 Power and Reset See the reference design of power circuit in figure 4‐1. Figure 4‐1 Power and reset circuit reference design diagram Power design The module is powered by VBAT. See the voltage characteristics in table 4‐1.
Intend to OEM Integrator Installation Reset Provide one 3S low pulse to the module’s /RESET pin to reset the module. After reset, the module will enter the power‐off status. Provide one at least 4S module’s ON/OFF pin to turn on the module again. low pulse to the V_MSME_1V8 There is a voltage output pin with current adjuster on MW3736 module, which can be used to supply external power to the board.
Intend to OEM Integrator Installation Figure 4‐2 UART interface level conversion 4）Connect to RXD and TXD only when there is no flow control in use; When using hardware flow control to connect other processors, use RXD, TXD, /CTS and /RTS; when used as Modem to connect to the PC, connect all IO signal cables (8 wires). Besides, the ringtone signal will produce low level interruption upon an incoming call or text message. Select the port IO signals for level conversion according to the specific conditions.
Intend to OEM Integrator Installation Descriptions of UART interface: Figure 4‐3 UART DCE－DTE connection relationship diagram See the definitions of UART1 interface in table 4‐2. Table 4‐2 Definitions of UART1 interface Classification No. Definitions I/O Descriptions Remarks UART (1.
Intend to OEM Integrator Installation 4.3 UIM card Interface The module supports 1.8V/2.85V UIM card. See the design in figure 4‐3. It’s recommended to add ESD to protect the UIM card. Table 4‐3 UIM card interface definitions Classification No. Definitions I/O Descriptions UIM 1 V_RUIM O RUIM card voltage 2 UIM_RST O RUIM card rest 3 UIM_CLK O RUIM card clock 4 UIM_DATA I/O RUIM card data Remarks The typical rate value of UIM card interface is about 3.
Intend to OEM Integrator Installation 4.4 Audio Interface (optional) The module provides one PCM interface, which must connect one CODEC externally to input and output audios. The module’s PCM interface provides PCM_CLK, PCM_SYNC, PCM_DIN, PCM_DOUT，and it supports 2.048MHz PCM clock data rate and 8K frame data rate. PCM clock will stop the output when it enters the dormant mode. The module’s PCM interface must work under Master mode, and the clock and SYNC signal must be sent by the module.
Intend to OEM Integrator Installation 4.5 Work Status Indicators The SIG_LED PIN output status is defined by the software. The SIG_LED PIN is MPP port, which can drive 20mA current. See the reference design of indicators in figure 4‐5.
Intend to OEM Integrator Installation 5 Mechanical Design 5.1 Appearance Diagram See MW3736 module’s appearance in figure 5‐1. Figure 5‐1 MW3736 module’s appearance diagram Dimensions: 39.50mm×31.00mm×2.65mm Weight: 10g © 第 20 页 ZTE Corporation. reserved.
Intend to OEM Integrator Installation 5.2 Module’s Assembly Diagram See the assembly diagram of the module in figure 5‐2. Figure 5‐1 Module’s assembly diagram It’s not allowed to spread without the permission of ZTE Corporation. © ZTE Corporation. All rights reserved.
Intend to OEM Integrator Installation 5.3 Module’s PCB Encapsulation Dimensions See the module’s PCB encapsulation dimensions in figure 5‐3. Figure 5‐2 PCB encapsulation diagram of relevant female socket (top view) © 第 22 页 ZTE Corporation. reserved.
Intend to OEM Integrator Installation Figure 5‐4 PCB encapsulation diagram of relevant female socket (bottom view) Precautions while designing PCB: 1） Copper‐clad and wiring are forbidden on each layer of the PCB at the area below the RF test points. 2） For the convenience of testing and maintenance, it might be necessary to drill holes on the PCB to expose J‐TAG test points. It’s not allowed to spread without the permission of ZTE Corporation. © ZTE Corporation. All rights reserved.
