Hardware Development Guide of Module Product Hardware Development Guide of Module Product Product Model No:ZM5202 Document Version: 2.
Hardware Development Guide of Module Product Legal Information By accepting this certain document of Shenzhen ZTEWelink Technology CO., LTD. (hereinafter referred to as “ZTEWelink”) you agree to the following terms. If you do not agree to the following terms, please notice that you are not allowed to use this document. The copyright of this document belongs to Shenzhen ZTEWelink Technology CO., LTD. Any rights not expressly granted herein are reserved.
Hardware Development Guide of Module Product Revision History Version 1.0 Date 2010-04-15 Description st 1 version 1. Delete the part of 3.13 and 3.14 in former version 2013-03-20 2. Change Logo of the header, footer and front cover 3. Modify the legal information 4. Modify the Reference document list in chapter 1.3 5. Add the module dimensions of top plane and thickness 6. Modify the chapter 7.7 of Recommended Product Upgrading Plan 7. Modify the Standby current from 3.5mA to 5mA in Table 2-1 8.
Hardware Development Guide of Module Product TABLE OF CONTENTS 1 About This Document .....................................................................................1 1.1 Application Range ............................................................................................................ 1 1.2 Purpose ............................................................................................................................ 1 1.3 Supported & Reference Document List .....................
Hardware Development Guide of Module Product 3.6 SD Card Interface .......................................................................................................... 18 3.6.1 Description of PINs ........................................................................................................ 18 3.6.2 Electric Feature .............................................................................................................. 19 3.6.3 Application of SD Card Interface........................
Hardware Development Guide of Module Product 4.3 5 Resetting Flow ............................................................................................................... 34 Technical Index of Radio Frequency ...........................................................35 5.1 Technical Index of Radio Frequency under UMTS Mode .............................................. 35 5.1.1 UMTS (WCDMA)..........................................................................................................
Hardware Development Guide of Module Product Figures Figure 2-1 Product Illustration .......................................................................................3 Figure 2-2 Module Dimensions .....................................................................................4 Figure 2-3 System Connection Structure ...................................................................... 8 Figure 3-1 PIN Configuration Diagram ........................................................................
Hardware Development Guide of Module Product Tables Table 1-1 Supported Document List ............................................................................. 1 Table 1-2 A bbreviation List ...........................................................................................2 Table 2-1 M ajor Technical Parameters ......................................................................... 6 Table 2-2 Working Frequency Band ............................................................................
Hardware Development Guide of Module Product 1 About This Document 1.1 Application Range This document is applicable as the hardware development guide of ZM5202 WCDMA module products. The user can design ZM5202 according to the requirement and guidance in this document. It is only applicable for the hardware application and development of ZM5202 WCDMA module products. 1.2 Purpose This document provides the design and development fundamentals for the users of ZM5202.
Hardware Development Guide of Module Product 1.4 Abbreviations Table 1-2 is a list of abbreviations involved in this document, as well as the English full names.
Hardware Development Guide of Module Product 2 Product Overview ZM5202 is one WCDMA wireless Internet module with LGA interface. It is widely applied to but not limited to the various products and equipment such as laptops, vehicle-mounted terminals, and e lectric devices, by providing data services. The features of ZM5202 module are described as below. 1. It can support UMTS 850(900)/1900/2100MHz frequency band, and GSM/GPRS/EDGE 850/900/1800/ 1900MHz frequency band. 2.
Hardware Development Guide of Module Product welding panel of the corresponding module. Figure 2-2 is a figure about the dimensions of ZM5202 module.
Hardware Development Guide of Module Product 2.2 Technical Parameters The major features of ZM5202 can be described from the aspects of mechanic feature, base band, radio frequency, technical standard and e nvironment feature. Table 2-1 is a l ist of the major technical parameters and f eatures supported by ZM5202.
Hardware Development Guide of Module Product Table 2-1 Name Major Technical Parameters Parameter Specifications Item Mechanical Dimensions 36mm * 26mm * (2.5+/-0.2)mm Feature Weight About 5.2g Encapsulation type Processor ARM 9 architecture architecture Standard 6 PIN SIM card interface (U)SIM/SIM Baseband LGA package(108 Pin) 3V SIM card and 1.8V SIM card Memory 32MByte/128MByte USB interface USB 2.0 HIGH SPEED Maximum power 2.2W consumption Voltage Working current 2 1 DC 3.
Hardware Development Guide of Module Product Name Parameter Specifications Item GSM850/900/1800/1900 : ≤-102dBm Equalization Main antenna interface Receive diversity (GPS) antenna interface Support Support Support the GPS wielding panel interface, support the diversity antenna interface; but they are not supported simultaneously. ZTEWelink does not provide the antenna, and the antenna is provided by the third party. GSM CS: UL 9.6kbps/DL 9.
Hardware Development Guide of Module Product Note: 1. Test condition: The value is measured in Max. transmit power. Note 2: Testing condition: The value is measured in transmit power of 0dBm and band of WCDMA 2100MHz. Note 3: Testing condition: The value is measured in cell power of -75dBm and DRX=640. Note 4: NA means unrelated. 2.3 Function Overview 2.3.
Hardware Development Guide of Module Product 3. Support GPS/AGPS; The working frequency band of ZM5202 transceiver transmitter is as shown in Table 2-2.
Hardware Development Guide of Module Product 3 Interfaces 3.1 Definition of PINs 3.1.1 Definition of PIN I/O Parameters The definition of ZM5202 I/O parameter is as shown in Table 3-1. Table 3-1 PIN Attribute PIN Parameters Description I Input PIN O Output PIN B Two-way digital port, CMOS input Z High-resistance output P1 PIN group 1, the power supply voltage is VDD_P1 P2 PIN group 2, the power supply voltage is VDD_P2 3.1.
Hardware Development Guide of Module Product Figure 3-1 3.1.
Hardware Development Guide of Module Product PIN 1 Signal Definition ANT_MAIN Pin Voltage -- I/O PIN Attribute AI, Main antenna AO feedback point PU/PD Remark Status -- Mandatory 2 GND -- -- Ground -- Mandatory 3 JTAG_RESOUT_N P1 DI JTAG reset LGA -- If it is not used, NC 4 PON_RST_N P1 DI Module reset -- If it is not used, NC 5 POWER_ON P1 DI Power-on/Power-off PU Mandatory -- If it is not used, NC PIN 6 AP_READY P1 DI Module queries AP sleep status 7 I2C_
Hardware Development Guide of Module Product PIN 22 Signal Definition LED_BLUE Pin Voltage P1 I/O AI PIN Attribute Signal PU/PD Remark Status indicator -- If it is not used, NC indicator -- System power supply, -- mandatory interface 23 VPH_PWR 24 VPH_PWR 25 VPH_PWR -- 26 VPH_PWR -- 27 UART_CTS 28 UART_RFR 3.
Hardware Development Guide of Module Product PIN Signal Definition Pin Voltage I/O PIN Attribute PU/PD Remark Status AO 47 GND -- -- Ground 48 VREG_RUIM P1/ P2 AO UIM card power -- Mandatory -- Mandatory signal 49 UIM_DATA P1/ P2 B UIM card data signal -- Mandatory 50 UIM_CLK P1/ P2 DO UIM card clock signal -- Mandatory 51 UIM_RST P1/ P2 DO UIM card reset signal -- Mandatory 52 UIM_DP P1/ P2 AI, Data signal -- If it is not used, NC Data signal -- If it
Hardware Development Guide of Module Product PIN Signal Definition Pin Voltage I/O PIN Attribute PU/PD Remark Status 75 JTAG_TDO P1 -- NC -- If it is not used, NC 76 JTAG_TDI P1 -- NC -- If it is not used, NC 77 JTAG_TMS P1 -- NC -- If it is not used, NC 78 GND -- -- Ground -- Mandatory 79.- GND -- -- Heat-dissipation -- Mandatory 108. welder Note: “NC” indicates Not Connected. That is, there is no connection inside the module.
Hardware Development Guide of Module Product 3.3 Feature of Interface Power Level 3.3.1 Feature of Digital Power Level Signal Table 3-4 Signal VIH Power Level Range of Digital Signal Description High level of Min Max Units 0.65*VDD_PX VDD_PX+0.3 V -0.3 0.35* VDD_PX V VDD_PX-0.45 VDD_PX V 0 0.45 V input voltage VIL Low level of input voltage VOH High level of output voltage VOL Low level of output voltage 3.4 Power Interface 3.4.
Hardware Development Guide of Module Product 3.5 (U)SIM Card Interface 3.5.1 Description of PINs ZM5202 WCDMA module baseband processor integrates the (U)SIM card interface in compliance with ISO 7816-3 standards, and supports to automatically detect 3.0V/1.8V (U)SIM cards. The signals on SIM card interface is as shown in Table 3-5.
Hardware Development Guide of Module Product between UIM_CLK, UIM_RST and GND, to filter out the interference by RF signals. It is recommended to cascade a 20ohm resistance on UIM_DATA cable. 3.5.3 Application of (U)SIM Card Interface Figure 3-2 (U)SIM Card Signal Connection Circuit 3.6 SD Card Interface 3.6.1 Description of PINs The SD card interface of ZM5202 module is the storage card based on FLASH, embedded with 4-bit and 1-bit SD controller, supporting SD and Mini SD cards.
Hardware Development Guide of Module Product 3.6.2 Electric Feature SDCC_CLK: Clock signal, host2device, default is 0~25MHz. SDCC_CMD: Command/response, two-way: the command can sent from the host to a single card/all cards, the response is sent from a single card/all cards to the host. SDCC_DATA[3..0]: Data cable, two-way, default is 0~12.5MB/sec. 3.6.3 Application of SD Card Interface Figure 3-3 is the reference design diagram for the SD interface.
Hardware Development Guide of Module Product 3.7 USB2.0 Interface 3.7.1 Description of PINs ZM5202 has the high-speed USB2.0 interface, which supports both the full-speed mode and the high-speed mode. The main processor (AP) is connected with the module via the USB interface to transmit data. 3.7.2 Electric Feature The USB interface complies with the USB2.0 specifications and the electric features.
Hardware Development Guide of Module Product Figure 3-4 USB Typical Circuit Application 3.8 Serial Interface 3.8.1 SPI (Serial Peripheral Interface) Bus Interface 3.8.1.1 Description of PINs The definition of SPI interface signaling is defined as shown in Table 3-7. Table 3-7 PIN 3.8.1.
Hardware Development Guide of Module Product Waiting mode: The waiting mode of SPI is a configurable low-power mode, enabled by the byte of the control registered. In the waiting mode, if the waiting byte is cleared, SPI works under the similar running mode. However, if SPI waits for the position byte, SPI clock stops and enters the low-power status. Stop mode: Under the stop mode, SPI is not available, so the power consumption is reduced.
Hardware Development Guide of Module Product 3.8.2.2 Electric Feature The I2C interface has the following features: 1. The two-wire bus is used for the communication between ICs. 2. It supports any external equipment of any manufacturing technology (1.8V). 3. It supports the external functions, such as the image sensor, micro controller, FM radio chip, LCD chip, audio DAC and keyboard interface.
Hardware Development Guide of Module Product 3.8.3 UART Interface 3.8.3.1 Description of PINs ZM5202 module provides a circuit of serial communication interface UART, which complies with the RS-232 interface protocol, and supports the 8-byte serial bus interface or 2-byte serial interface is Via the UART interface. But the 8-byte serial bus UART interface and the SPI bus interface are not supported simultaneously.
Hardware Development Guide of Module Product 4-wire or 2-wire mode can be us ed for connection. The module interface PWL is 1.8V. If it does not match the PWL of AP interface, it is recommended to add the PWL conversion circuit. The connection of ZM5202 UART port and standard RS-232-C interface can be through the chip like class 232. The design involves the transformation of TTL level and EIA level. We recommend to use the chip of NLSX5014MUTAG.
Hardware Development Guide of Module Product 3.9 JTAG (Joint Test Action Group) Interface 3.9.1 Description of PINs The JTAG interface complies with the ANSI/ICEEE Std. 1149.1-1990 standard, and the interface is defined as shown in Table 3-9.
Hardware Development Guide of Module Product Figure 3-9 Module Power-on Plan PON_RST_N PIN is used to reset the module. After pushing PON_RST_N PIN for 50ms, pull it higher again and then reset the module. 3.10.2 Interface Application The POWER_ON and PON_RST_N circuits can refer to the design circuit as shown in Table 3-9. In this figure, the two input signals on t he left are the input control signals for reset and power-on respectively.
Hardware Development Guide of Module Product 3.11 Interactive Application Interface 3.11.1 Description of PINs Table 3-10 mainly describes the interfaces interacting with the application processor, including the following three types of interfaces: querying, wakeup and status indication. Table 3-10 PIN Signal Name I/O Type Function Module querying AP 6 AP_READY DI 9 MODULE_READY DO 10 AP_WAKEUP_MODULE DI AP wakeup Module DO Module wakeup AP 11 19 3.11.
Hardware Development Guide of Module Product PWL, the module cannot enter the sleep status. After the AP server enters the high PWL, the module enters the sleep status. MODULE_WAKEUP_AP: Make sure that the function of remote wake up is enabled in the config file. When a S MS or call is receiving, the output level of this pin is shown in the following figure: low for 2s—high for 15s—low for 2s—high for 15s—low for 2s before return its default high level to wakeup the AP side.
Hardware Development Guide of Module Product 3.12.2 Interface Application The LGA module has three PINs to control the LED indicator, used to indicate the network connection status. The different modes of status indicator flashing indicate different network statuses. All the three PINs use the current sink type of current source for control, which connects to the negative end of LED and connects to VPH_PWR externally, to directly drive LED. Figure 3-12 is the reference circuit design diagram.
Hardware Development Guide of Module Product 4 Electric Feature 4.1 Power Feature 4.1.1 Power Supply The input voltage range of ZM5202 is DC 3.4V~4.2V, and the typical value is 3.8V, as shown in Table 4-1. Table 4-1 Parameter Input Min 3.4V Input Voltage Typical 3.8V Max 4.2V voltage 4.1.2 Working Current The working current range of ZM5202 is as shown in Table 4-2. The IDLE mode indicates the power consumption of the module when there is no service.
Hardware Development Guide of Module Product 4.2 Power-on/Power-off Flow To guarantee the user can power on and power off stably, you can refer to the power-on sequence chart as shown in Figure 4-1 and the power-off sequence chart as shown in Figure 4-2. Table 4-3 shows the power-on and resetting time, which needs to be paid attention to during the module power-on process. 1. Once VPH_PWR is powered on, the POWER_ON signal will be synchronized and be established as the high PWL. 2.
Hardware Development Guide of Module Product Figure 4-1 Power-on Sequence Chart of ZM5202 Module T1 VPH_PWR T3 USB_VBUS POWER_ON T2 Figure 4-2 Power-off Sequence Chart of ZM5202 Module T5 VPH_PWR USB_VBUS T4 POWER_ON Table 4-3 Parameter T1 Power-on/Power-off Time Description From powering on VPH_PWR to Min Typical Max Unit 0 0.5 1 second 1 1.5 -- second 0.05 0.
Hardware Development Guide of Module Product 4.3 Resetting Flow The PON_RST_N reset signal of ZM5202 module is the increasing resetting, so it is reset after decreasing this PIN by 100ms. Figure 4-3 is the module resetting flow.
Hardware Development Guide of Module Product 5 Technical Index of Radio Frequency 5.1 Technical Index of Radio Frequency under UMTS Mode 5.1.1 UMTS (WCDMA) The RF index should be tested strictly in accordance with the related testing specifications of 3GPP. The RF indexes of UMTS2100/1900/850 should satisfy the requirements of 3GPP TS 34.121 protocol. 5.
Hardware Development Guide of Module Product 5.3.1 Sourceless Index The sourceless indexes of antenna are different according to the different requirements of wireless Internet products. Here, taking the 3G Internet notepad as an example, the sourceless index of the antenna is recommended to reach the standards as described below.
Hardware Development Guide of Module Product 6 Related Test & Testing Standard 6.1 Testing Reference The related tests of ZM5202 comply with the IEC standard, including the equipment running under high/low temperature, storage under high/low temperature, temperature shock and EMC. Table 6-1 is the list of testing standard, which includes the related testing standards for ZM5202. Table 6-1 Testing Testing Standard Document Reference Standard IEC6006826 Environmental testing-Part2.
Hardware Development Guide of Module Product 6.2 Description of Testing Environment The working temperature range of ZM5202 is divided into the normal working temperature range and the extreme working temperature range. Under the normal working temperature range, the testing result of RF complies with the requirements of 3GPP specifications, and its function is normal.
Hardware Development Guide of Module Product 6.3 Reliability Testing Environment The reliability test includes the vibration test, high/low-temperature running, high/low-temperature storage and temperature shock experiment test. Refer to Table 6-4 for the specific parameters. Table 6-4 Testing Item Reliability Features Testing Condition Testing Standard Random Frequency range: 5-20Hz, vibration PSD:1.
Hardware Development Guide of Module Product 6.4 Reliability Testing Result Table 6-5 Mode Temperature Testing Result Under Windless Environment Temperature Voltage Transmission Duration Power GPRS Testing Result +25 ℃ (3.8±10%)V Max ≥1hour Pass +25 ℃ (3.8±10%)V Max ≥1 hour Pass +25 ℃ (3.
Hardware Development Guide of Module Product 7 Design Guide This chapter provides the general design guide for ZM5202, used as a reference for the user during the design process, so that the product can reach better performance. 7.
Hardware Development Guide of Module Product 7.3 RF Circuit Design 7.3.1 RF Antenna Circuit Design There are two interfaces on the RF antenna of ZM5202: main antenna interface, and GPS antenna. The main antenna supports two access modes of RF signal: by PDA wielding panel mode and by RF connector mode. The GPS antenna only supports the access mode of LGA wielding panel.
Hardware Development Guide of Module Product All Rights reserved, No Spreading abroad without Permission of ZTEWelink 43
Hardware Development Guide of Module Product Figure 7-2 Figure 7-3 Interface of Main Antenna and AGPS Antenna Welding Pad RF Interface Testing Console (W.FL-R-SMT-1 from HRS) If the main antenna is access by the RF connector, the corresponding cables of RF interface are recommended to use the W.FL-LP-04N of HRS company, as shown in Figure 7-4.
Hardware Development Guide of Module Product Figure 7-4 Testing Cable If the main antenna is accessed by the PDA wielding panel, the RF main antenna wield pane of the module itself needs to be connected to the antenna interface on main board via the wield pane and micro stripline or stripline. The micro stripline or stripline is designed according to the 50ohm impedance, and the dual-L model matching circuit is reserved.
Hardware Development Guide of Module Product its structure. Therefore, during the initial design, make the layout evaluation with the structure, ID, circuit and antenna engineers together. 7.3.2.2 Suggested Antenna Location For the notepad, the ideal location position for the antenna is on the left corner or right corner of LCD, because this position is relatively far away from the main board, so the electromagnetic interface is little.
Hardware Development Guide of Module Product 3G module cannot go on the right angle, cannot be crushed or worn. The RF cable should better be wired close to the ground of main board. 7.3.2.
Hardware Development Guide of Module Product (U)SIM card signal interface, the ESD device should be placed closely for protection. Besides, on the side of main board, the user should reasonably design the structure and PCB layout, guarantee that the metallic shielding shell is fully grounded, so as to leave a smooth discharge channel for ESD. 7.
Hardware Development Guide of Module Product 7.7 Recommended Product Upgrading Plan It’s recommended to use the one-click software upgrade tool to upgrade through the USB port provided by ZTEWelink in the Windows system. If the customer wants to upgrade the module in other operation systems, ZTEWelink provides the corresponding reliable tools too.
Hardware Development Guide of Module Product 8 Manufacturing Guide 8.1 Design of Steel Mesh During the design of steel mesh, note: 1. When manufacturing the steel mesh of thermal pad on the bottom of the module, narrow the mouth of the steel mesh to 75% of the original size, so as to reduce the risk of shortcut between the module thermal and the peripheral PINs. This method is effective. 2. It is recommended to design to the mouth of steel mesh on the thermal pad wielding panel to the lattice form.
Hardware Development Guide of Module Product curve, and refer to Figure 8-3 for the testing result. Figure 8-2 and Figure 8-3 are only a reference, and refer to Table 8-1 for the detailed requirements. 9 FCC Regulations: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Hardware Development Guide of Module Product Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. USERS MANUAL OF THE END PRODUCT: In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied.
Hardware Development Guide of Module Product Figure 8-1 Furnace Temperature Curve Reference Diagram Figure 8-2 Testing Result All Rights reserved, No Spreading abroad without Permission of ZTEWelink 53
