User's Manual
Table Of Contents
- Legal Information
- 1 About This Document
- 2 Product Overview
- 3 Interfaces
- 3.1 Definition of PINs
- 3.2 Working Condition
- 3.3 Feature of Interface Power Level
- 3.4 Power Interface
- 3.5 (U)SIM Card Interface
- 3.6 SD Card Interface
- 3.7 USB2.0 Interface
- 3.8 Serial Interface
- 3.9 JTAG (Joint Test Action Group) Interface
- 3.10 Power-on/Power-off & Reset Signal
- 3.11 Interactive Application Interface
- 3.12 LED Indicator Interface
- 4 Electric Feature
- 5 Technical Index of Radio Frequency
- 6 Related Test & Testing Standard
- 7 Design Guide
- 7.1 General Design Rule & Requirement
- 7.2 Power Supply Circuit Design
- 7.3 RF Circuit Design
- 7.4 Suggestions for EMC & ESD Design
- 7.5 Suggestions for PCB Wielding Panel Design
- 7.6 Suggestions for Heat-dissipation Design
- 7.7 Recommended Product Upgrading Plan
- 8 Manufacturing Guide
- 9 FCC Regulations:
Hardware Development Guide of Module Product
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2 Product Overview
ZM5202 is one WCDMA wireless Internet module with LGA interface. It is widely
applied to but not limited to the various products and equipment such as laptops,
vehicle-mounted terminals, and e lectric devices, by providing data services. The
features of ZM5202 module are described as below.
1. It can support UMTS 850(900)/1900/2100MHz frequency band, and
GSM/GPRS/EDGE 850/900/1800/ 1900MHz frequency band.
2. It can provide high-speed data access service under the mobile environment.
3. It provides the SPI interface, I2C interface, (U)SIM card interface (3.0V/1.8V),
USB2.0 interface, UART interface, SD2.0 interface, power-on/power-off, and
resetting.
Figure 2-1 Product Illustration
2.1 Mechanic Features
ZM5202 is a 108-pin LGA encapsulation module. Except for the signal PIN, there
are many dedicated heat-dissipation ground wielding panel to improve the
grounding performance, mechanical strength and heat-dissipation performance.
There are altogether 30 heat-dissipation ground wielding panels, evenly distributed
at the bottom of PCB. The dimensions of 108-pin LGA encapsulation are 26*36mm,
and the height is 2.5+/-0.2mm. The location of PIN 1 is identified by the ground
wielding panel with an inclination at the bottom, and its angle orientates to the top