User's Manual
Table Of Contents
- ZTEWelink Hardware Development Guide of ZM8620_V2 Module Product_V2.3.pdf
- Legal Information
- 1 About This Document
- 2 Product Overview
- 3 Mechanic Feature
- 4 Pin Description
- 5 Electric Feature
- 6 Related Test & Testing Standard
- 7 RF Specifications
- 8 Antenna
- 9 Debugging Environment and Method
- 10 Package System
- 11 Safety Information
- 12
Hardware Development Guide of Module Product
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ZM8620_V2
Figure 3–2 Antenna Interface Flag Diagram (with Diversity)
Figure 3–3 Radio Frequency Interface Test Base
This product antenna is placed on the side of the system board. If this product is embedded in a notebook,
place it on the top of the LCD screen.
3.3 Thermal Design
The thermal design of this product strictly complies with the specification [PCI Express Mini Card
Electromechanical Specification Revision 1.2, October 26, 2007], and distributes the heat source evenly,
and has excellent heat dissipating design. As the maximum power consumption of the overall system is
very high when transmitting, if it is impossible to ensure the temperature of ZM8620_V2 less than 60°C,
the rise of the overall system temperature will lead to the performance degradation of ZM8620_V2, or
even not operate normally. In order to ensure product performance, safety and stability, the following
proposals are provided for the main board design:
(a) the module far away from the switch power and high-speed signal cable as much as