MC2261_V2 HARDWARE DEVELOPMENT GUIDE OF MODULE PRODUCT Version: V2.1 Date: 2016-04-18 CDMA Module Series Website: www.ztewelink.com E-mail: ztewelink@zte.com.
MC2261 Hardware Development Guide of Module Product LEGAL INFORMATION By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as ZTEWelink), you are deemed to have agreed to the following terms. If you don’t agree to the following terms, please stop using the document. Copyright © 2015 Shenzhen ZTEWelink Technology Co., Ltd. All rights reserved. The document contains ZTEWelink’s proprietary information.
MC2261 Hardware Development Guide of Module Product REVISION HISTORY Version Date Description V1.0 2010-11-30 First published V1.1 2010-12-20 Modify Table 2-1 V1.2 2011-02-22 Update image V1.3 2011-02-25 Change Operational Temperature Range V1.4 2011-03-07 Modify Table 2-1 and power management V1.5 2011-03-29 Modify content of 3.1 power management and 5.2.5 antenna matching V1.6 2011-04-25 Modify 2.1 (add note), 3.5(add new content) V1.7 2011-06-15 Modify the email for supports.
MC2261 Hardware Development Guide of Module Product ABOUT THIS DOCUMENT A. Application Range R&D personnel using CDMA modules to make the second development B. Reading Note The symbols below are the reading notes you should pay attention on: : Warning or Attention : Note or Remark CONTACT INFORMATION Post 9/F, Tower A, Hans Innovation Mansion, North Ring Rd., No.9018, Hi-Tech Industrial Park, Nanshan District, Shenzhen. Web www.ztewelink.com Phone +86-755-26902600 E-Mail ztewelink@zte.com.
MC2261 Hardware Development Guide of Module Product SAFETY INFORMATION The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating ME3610 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product.
MC2261 Hardware Development Guide of Module Product Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
MC2261 Hardware Development Guide of Module Product Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
MC2261 Hardware Development Guide of Module Product CONTENTS 1. Mechanical Interface ............................................................................................................................................... 11 1.1. Physical Features ........................................................................................................................................................................ 11 1.2. Mechanical size ...............................................................
MC2261 Hardware Development Guide of Module Product 6.4.4. Low Temperature Storage Test ........................................................................................................................................ 32 6.4.5. High Temperature High Humidity Operation Test ........................................................................................................... 32 6.4.6. Temperature Concussion Test ....................................................................................
MC2261 Hardware Development Guide of Module Product TABLES Table 1–1 Major Technical Parameters ................................................................................................................................................ 11 Table 2–1 MC2261 Module 68-pin Electrical Interface ........................................................................................................................ 14 Table 2–2 Baseband digital I/O characteristics for VDD_PX = 1.8 V nominal ............
MC2261 Hardware Development Guide of Module Product FIGURES Figure 1–1 MC2261 TOP SIDE ............................................................................................................................................................... 12 Figure 1–2: MC2261 BOTTOM SIDE ......................................................................................................................................................... 12 Figure 1–3 MC2261 Module Illustration ................................
MC2261 Hardware Development Guide of Module Product 1. MECHANICAL I NTERFACE 1.1. P HYSICAL F EATURES Table 1–1 Major Technical Parameters Item Specifications Dimensions & Weight Length: 34.4 mm Width: 30 mm Thickness: 3.3 mm Weight: 8g Operational Temperature Range -30℃ to +75℃ Storage Temperature Range -40℃ to +80℃ ROHS Yes Antenna Connectors 50-Ohm ANT connectors for CDMA Power Supply Powered by the VPH_PWR pin (+3.3V~ +4.2V, typical value：3.
MC2261 Hardware Development Guide of Module Product Figure 1–1 MC2261 TOP SIDE Figure 1–2: MC2261 BOTTOM SIDE All Rights reserved, No Spreading abroad without Permission 12
MC2261 Hardware Development Guide of Module Product Figure 1–3 MC2261 Module Illustration NOTE: The picture above is just for reference, please take the actual product as the referece.
MC2261 Hardware Development Guide of Module Product 2. E LECTRICAL I NTERFACE 2.1. P IN A SSIGNMENTS Table 2–1 MC2261 Module 68-pin Electrical Interface No. Signal Signal Type Input/output Description Name 1 GND_RF 2 RF_ANT Typical Default (Internal Value PU/PD) Comments Ground Analog I/O Connect 50ohm Connect 50ohm antenna or feed antenna or feed 3 GND_RF Ground 4 GPIO0 Digital I/O GPIO 1.8V 0（Output PD） 1.8V Level， 5 GPIO1 Digital I/O GPIO 1.8V 0（Output PD） 1.
MC2261 Hardware Development Guide of Module Product 30 NA Reserved 31 NA Reserved 32 GND 33 VPH_PWR Ground P (input) Main power 3.8 Power range: 3.3V-4.2V 34 VPH_PWR P (input) Main power 3.8 Power range: 3.3V-4.2V 35 NC 36 VBAT Not connected P (input) Used for 3.8 Power range: module’s power 3.3V-4.
MC2261 Hardware Development Guide of Module Product Ready Connect to DCD, 2.85V Level 60 DSR I Data Set Ready 2.85V UART Port, Connect to DTR, 2.85V Level 61 NA 62 GND 63 USE_LED Reserved Ground O In-use LED LED ON as the level is high. 2.85V Level 64 NA Reserved 65 NA Reserved 66 GPIO42 Digital I/O GPIO 1.8V 0（Iutput PD） 1.8V Level 67 GPIO43 Digital I/O GPIO 1.8V 0（Iutput PD） 1.8V Level 68 GND Ground NOTE: 1 All the pin can be left open ,when they are not used.
MC2261 Hardware Development Guide of Module Product 3. A PPLICATIONS 3.1. P OWER M ANAGEMENT The module could work under the conditions as follows: Connect VPH_PWR and VBAT pins together, and then connect to the power as shown in Figure 3-1. Figure 3–1 Powered by VBAT and VPH_PWR pin Refer to Table 3-1 for the module’s input power characteristics. If the input voltage is not in the range, it must be converted to the voltage below: Table 3–1 Input Power Characteristics Status Max.
MC2261 Hardware Development Guide of Module Product Figure 3–2 USB Typical Circuit 3.4. UART Pins of MSM_CTS, MSM_RTS, MSM_RXD and MSM_TXD are 1.8V level respectively for the external interface, when connecting with level circuit which is not 1.8V will need the level switch connection. Pins of MO_RI, DCD, DTR and DSR are the level of 2.85V respectively for the external interface, when connecting with level circuit which is not 2.85V will need the level switch connection.
MC2261 Hardware Development Guide of Module Product Figure 3–5 wire serial level conversion circuit 3.5. P OWERING THE M ODULE U SING THE MDB Place the module on the MDB (Module Development Board), then plugging one end of USB cable in PC and another in MDB, if the power supplied by the USB port, the X3 doesn’t supplied the power. If not use the USB port, the X3 can supplied the power (DC5V), when the users power the module’s development board, the module will be automatically powered on.
MC2261 Hardware Development Guide of Module Product Connect the sector to access terminal antenna connectors as shown in the following Figure 3-8 or Figure 3-9.
MC2261 Hardware Development Guide of Module Product 4. A NTENNA INTERFACE The RF interface of the MC2261 Module has an impedance of 50 ohm. The module is capable of sustaining a total mismatch at the antenna connector or pad without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, DC-power consumption, modulation accuracy and harmonic suppression.
MC2261 Hardware Development Guide of Module Product Material Properties ■ MC2261 Module PCB: FR4 ■ Antenna pad: Gold plated pad 4.3. A NTENNA CONNECTOR The MC2261 Module uses a microwave coaxial connector supplied by Murata Ltd. The product name is NMM22-5017. The position of the antenna connector on the Module PCB can be seen in Figure 5-1.
MC2261 Hardware Development Guide of Module Product The daughter board of MC2261 Module uses a microwave coaxial connector supplied by CNT Ltd. The product name is SSMB-50TKE-10. The position of the antenna connector on the daughter PCB can be seen in Figure 5-2.
MC2261 Hardware Development Guide of Module Product 5. RF I NTERFACE 5.1. O VERVIEW A 50 ohm coaxial RF connector is provided for Module testing. However, we advise customers lead from the antenna pad at the RF line to the antenna. Figure 5–1 CDMA Connector Another 50 ohm coaxial RF connector on daughter board is provided for Module testing and customer showing.
MC2261 Hardware Development Guide of Module Product Table 5–1 The requirement of dual band antenna Band TX Frequency RX Frequency PCS 1850-1910 MHz 1930-1990 MHz Cellular 824-849 MHz 869-894 MHz NOTE: TX refers to the transmit from the module into the antenna (Reverse Link of the CDMA system), and RX refers to the receive from the antenna into the module (Forward Link of the CDMA system). 5.2.
MC2261 Hardware Development Guide of Module Product Figure 5–3 Antenna Matching Circuit . 5.2.6. PCB DESIGN CONSIDERATIONS • The antenna subsystem should be treated like any other RF system or component. It should be isolated as much as possible from any noise generating circuitry including the interface signals via filtering and shielding.
MC2261 Hardware Development Guide of Module Product 6. T EST C APABILITIES 6.1.
MC2261 Hardware Development Guide of Module Product Figure 6–3 First method to connect the module to RF test equipment Figure 6–4 Second method to connect the module to RF test equipment Connect the RF antenna to terminal antenna connectors as shown in the following Figure 6-5 or Figure 6-6: All Rights reserved, No Spreading abroad without Permission 28
MC2261 Hardware Development Guide of Module Product Figure 6–5 First method to connect the module to RF antenna Figure 6–6 Second method to connect the module to RF antenna 6.2. CDMA T EST E QUIPMENT AND T OOLS Lease or purchase of test equipment is available from vendors who provide this equipment for CDMA over the-air simulation.
MC2261 Hardware Development Guide of Module Product 6.3. RF P ERFORMANCE R EQUIREMENTS 6.3.1. CDMA2000 1X RF RX SPECIFICATION Table 6–1 CDMA2000 1X RF Rx Specification Frequency range 869~894MHz/1930~1990MHZ Rx. Sensitivity -104 dBm(FER≤0.5％) Rx. Signal Range -25 dBm~ -104dBm(FER≤0.5％) Immunity FER≤1.0％(-101dBm/BW , 30dBm@±900KHz) (800MHz) FER≤1.0％(-101dBm/BW ,-40dBm@±1250KHz) (1900MHz) Inter-modulation spurious emissions FER≤1.0％(Test1: -101dBm/BW ,+900/+1700KHz, -43dBm) FER≤1.
MC2261 Hardware Development Guide of Module Product Code domain power <-61dBm Transmitter time error ±1.0μs Waveform quality factor >0.944 Open loop power control (Test 1: -25dBm/1.23MHz)-48dBm/1.23MHz±9.5dBm (Test 2: 1: -65dBm/1.23MHz)-8dBm/1.23MHz±9.5dBm -25dBm/1.23MHz)-51dBm/1.23MHz±9.5dBm 2: -93.5dBm/1.23MHz)+20dBm/1.23MHz±9.5dBm -65dBm/1.23MHz)-11dBm/1.23MHz±9.5dBm (Test 3: Close loop power control (Test 3: -91.3dBm/1.23MHz)+15dBm/1.23MHz±9.
MC2261 Hardware Development Guide of Module Product 6.4.3. HIGH TEMPERATURE STORAGE TEST Table 6–5 High Temperature Storage Test EUT Status Power-off Temperature 85℃ Duration 24h 6.4.4. LOW TEMPERATURE STORAGE TEST Table 6–6 Low Temperature Storage Test EUT Status Power-off Temperature -45℃ Duration 24h 6.4.5. HIGH TEMPERATURE HIGH HUMIDITY OPERATION TEST Table 6–7 High Temperature High Humidity Operation Test EUT Status Power-on Temperature 55℃ Humidity 93% Duration 48h 6.4.6.
MC2261 Hardware Development Guide of Module Product 6.5. E LECTRO M AGNETIC C OMPATIBILITY 6.5.1. ESD IMMUNITY TEST Table 6–9 ESD Immunity Test EUT Status Idle mode and traffic mode Test Voltage Air ±8KV; Contact ±6KV Reference Standard IEC 61000-4-2 : 2001 6.5.2.
