Sepa Two-component adhesive -55 ... 150 °C
HERNON 746 SET-04
Categories
Description
Two-component adhesive with fast curing. Excellent thermal conductive. Necessary corrections can be made within 15-30 seconds. Secure after 5 minutes at room temperature and is fully cured within 24 hours. For bonding transistors, microprocessors and other heat generating components to PCBs or coolers.
Manuals
| # | Title | Languages | Pages | Updated |
|---|---|---|---|---|
| 1 | Datasheet | EN | 2 | 2020-11-07 |
| 2 | Datasheet | SV | 8 | 2020-11-07 |
| 3 | Datasheet | DA | 8 | 2020-11-07 |
| 4 | Datasheet | NL | 8 | 2020-11-07 |
| 5 | Datasheet | EN | 4 | 2020-11-07 |
| 6 | Datasheet | DE | 10 | 2020-11-07 |
| 7 | Datasheet | IT | 8 | 2020-11-07 |
| 8 | Datasheet | SV | 7 | 2020-11-07 |